RHP200/150 Series
Rapid thermal processing system used for leading edge processes for memory or logic devices
- Temperature rang : 400 - 1350℃
- Temperature repeatability: ±1℃ (@ bare wafer)
- Temperature ramp up rate: 250℃/s (@ ATM process)
- Temperature cool down rate: 100℃/s
- Tel
- +82-31-5187-1604
- hschoi@globalzeus.com
mark@globalzeus.com (US)